Friday, December 6 • 2:30 PM – UTEB 175
Smart Surfaces: Integration of Flexible
Electronics with Building Materials
Wei Wu
Principal Investigator
at DuPont Electronics & Imaging
Abstract: As one of the world’s largest electronic and building material suppliers, DuPont has many top
brands and technologies in the areas of flexible hybrid electronics such as flexible/wearable conductive inks
and films, and large-scale rigid and flexible substrates. Smart Materials in DuPont has been focusing on the
convergence of electronics and building industries and produces a new category of integrated materials and
Internet of Things end points. In this seminar, I’ll present a few of our prototypes and use cases on how we
design and integrate sensing and actuations within the building and construction materials. These flexible
electronic functionalities add the invisible features to the material surfaces and provide a new level of
enhanced aesthetics, design options, and human-building interactions inside the buildings.
Biographical Sketch: Dr. Wei Wu is Principal Investigator in the Electronics and Imaging business of
DuPont. He is currently working in Smart Materials as a project technical lead and has developed many
electronic technologies and integrated prototypes of building materials and electronics. He joined DuPont
Central Research and Development in 2011 and has led a few R&D projects on photovoltaics, thin-film
electronics, and wearables. Dr. Wu received his PhD and MS in Electrical Engineering at Northwestern
University and his BS in Microelectronics at Peking University. He has published over 40 peer-reviewed
articles and been invited to give many technical talks.
For additional information, please contact Prof. George Matheou at (860) 486-8729, matheou@uconn.edu or
Laurie Hockla at (860) 486-2189, laurie.hockla@.uconn.edu
For more information, contact: Ying Li at ying.li@uconn.edu